Description
IS215WEPAH2BB General Electric Processor Board Mark VI
высотой 3U, расположенный в раме управления под DSPX.
волоконно – оптический разъем на передней панели и передаются в модуль обнаружения заземления.
ABB: Запасные части для промышленных роботов серии DSQC, Bailey INFI 90, IGCT, например: 5SHY6545L0001 AC1027001R0101 5SXE10 – 0181, 5SHY3545 L0009, 5SHI3545L0010 3BHB013088 R0001 3BHE009681R0101 GVC750BE101, PM866, PM861K01, PM864, PM510V16, PPD512, PPPD113, PP836A, P865A, 877, PPP881, PPPP885, PPSL500000 4 3BHL00390P0104 5SGY35L4510 и т.д.
General Electric: запасные части, такие как модули, карты и приводы. Например: VMVME – 7807, VMVME – 7750, WES532 – 111, UR6UH, SR469 – P5 – HI – A20, IS230SRTDH2A, IS220PPDAH1B, IS215UCVEH2A, IC698CPE010, IS200SRTDH2ACB и т.д.
Система Bently Nevada: 350 / 3300 / 1900, предохранительные зонды и т.д., например: 3500 / 22M, 3500 / 32, 3500 / 15, 3500 / 23500 / 42M, 1900 / 27 и т.д.
Системы Invis Foxboro: Серия I / A, управление последовательностью FBM, трапециевидное логическое управление, обработка отзыва событий, DAC,
обработка входных / выходных сигналов, передача и обработка данных, такие как FCP270 и FCP280, P0904HA, E69F – TI2 – S, FBM230 / P0926GU, FEM100 / P0973CA и т.д.
Invis Triconex: Модуль питания, модуль CPU, модуль связи, модуль ввода – вывода, например 300830937214351B, 3805E, 831235114355X и т.д.
Вудворд: контроллер местоположения SPC, цифровой контроллер PEAK150, например 8521 – 0312 UG – 10D, 9907 – 149, 9907 – 162, 9907 – 164, 9907 – 167, TG – 13 (8516 – 038), 8440 – 1713 / D, 9907 – 018 2301A, 5466 – 258, 8200 – 226 и т.д.
Hima: модули безопасности, такие как F8650E, F8652X, F8627X, F8678X, F3236, F6217, F6214, Z7138, F8651X, F8650X и т.д.
Honeywell: Все платы DCS, модули, процессоры, такие как: CC – MCAR01, CC – PAIH01, CC – PAIH02, CC – PAIH51, CC – PAIX02, CC – PAON01, CC – PCF901, TC – CR014, TC – PD011, CC – PCNT02 и т.д.
Motorola: серии MVME162, MVME167, MVME172, MVME177, такие как MVME5100, MVME5500 – 0163, VME172PA – 652SE, VME162PA – 344SE – 2G и другие.
Xycom: I / O, платы VME и процессоры, такие как XVME – 530, XVME – 674, XVME – 957, XVME – 976 и т.д.
Коул Морган: Сервоприводы и двигатели, такие как S72402 – NANA, S6201 – 550, S20330 – SRS, CB06551 / PRD – B040SSIB – 63 и т. Д.
Bosch / Luxer / Indramat: модуль ввода / вывода, контроллер PLC, приводной модуль, MSK060C – 0600 – NN – S1 – UP1 – NNN, VT2000 – 52 / R900033828, MHD041B – 144 – PG1 – UN и т.д.
In addition, the exhibition area of this exhibition, with the theme of “One-stop Electronic Manufacturing Supply Chain Ecosystem”,
attracted domestic high-quality PCB manufacturing companies and nearly 50 high-end intelligent manufacturing EMS companies, such
as Zidian, Higer, Guangshang Technology, Sri Lanka Bitai, Hongyi Technology,
Jieshi, Yilade, Xushengtai, Lvcheng, Chengda Weiye, Meida High Frequency, Muhe, Yanhongda, Yingjiang, Baiqiancheng, Manchester
United, Xingkexun, Ke Nearly 50 companies, including Neng, Grandtop and Yingchuang, competed on the same stage, bringing cutting-edge
cases of international electronic manufacturing services and providing faster resource docking.
Loading machines, furnace front AOI, unloading machines, and labeling machines from Chuangjinxin; Zhengshi marking machines
and printing machines; Luyuan CPM-F2 multifunctional placement machine; Jaguar”s ten-temperature zone dual-track nitrogen-free Lead
hot air reflow soldering R10-D; Weiming Technology de ZHX-R20CE-IN online automatic vertical plug-in machine; as well as Bojie”s D3380
series (single valve version) and other domestic intelligent manufacturing groups have set up
China”s intelligent manufacturing production lines on site to truly restore every step with a “one-stop intelligent manufacturing solution” The
process is precise, fast, efficient and flexible.
Focus on the development of China”s electronic components industry, new layout
ES SHOW 2021 is a commercial exhibition focused on comprehensively displaying various electronic components and material products
required for the design and production of electronic products. It is jointly created by the Shenzhen Electronics Chamber of Commerce and Reed Exhibitions Exhibitions (NEPCON).
330103-00-03-10-02-00 | Approach probe | New original
330100-50-05 | Preprocessor sensor | In stock
330100-90-05 | Preprocessor sensor | New original
330100-90-00 | Preprocessor sensor | In stock
3300/16 | Gap dual vibration monitor | In stock
3300/20-12-01-02-01-02 | Dual thrust position monitor | New original
31000-16-10-00-154-00-02 | 31000 close to probe housing | In stock
24765-03-01 | Expansion transducer assembly| New original
24765-02-01 | Enclosure extension transducer assembly | In stock
24765-02-00 | Enclosure extension transducer assembly | New original
24765-01-01 | Vibration monitor | In stock
2300/20-CN | Vibration monitor | New original
2300/20-00-00 | Vibration monitor | In stock
2300/20_KIT-001-00 | Condition monitoring system suite | New original
2300/20_KIT-001-02-00 | Condition monitoring system suite | In stock
2300/20-00 | Vibration monitor | New original
1900/65A-01-01-03-CN-00 | Universal device monitor | In stock
1900/65A-01-00-03-CN-01 | Universal Device monitor | New original
1900/65A-01-00-03-00-01 | Universal device monitor | In stock
1900/65A-00-01-01-CN-00 | Universal device monitor | In stock
1900/65A-00-01-03-00-00 | Universal Device monitor | New original
1900/65A-00-00-01-00-00 | Universal device monitor | In stock
330100-50-05 | Preprocessor sensor | New original
143416-01 | I/O module | In stock
143416-01 | Preprocessor sensor
18745-03 | Preprocessor sensor
177314-02 | Close to system test suite TK-3E
177314-01 | Close to system test suite TK-3E
177313-02-02 | Close to system test suite TK-3E
177313-02-01 | Close to system test suite TK-3E
135613-03-00 | High temperature enclosure expansion transducer assembly
135613-02-00 | High temperature enclosure expansion transducer assembly
177313-01-02 | Access to system test suite
135613-01-00 | High temperature enclosure expansion transducer assembly
2300/20_KIT-001-02-00 | Condition monitoring system suite
135613-01-00 | High temperature enclosure expansion transducer assembly
125840-02 | Ac power input module
126648-01 | External terminal
106M1079-01 | Ac power module
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