Description
hardware flow control. It is an ideal choice in the field of industrial automation.
Activities in the automotive electronics sector will include: SAE-AWC 2021 Automotive Electronics Innovation
Technology Forum, ” Smart Car ” Hundred Forum ” Issue 21 –
China Automotive Semiconductor Technology Summit Forum ” , AWC 2021 Third Automotive Digital Cockpit
Forum wait. At the same time, the China Intelligent Connected Vehicle Industry Summit will invite speakers
from well-known industry companies, research institutions, universities and other industries with advanced technological
advantages in the field of intelligent connected vehicles and new energy vehicles to share their experience in
the design, development and production of intelligent connected vehicles. Problem solving and innovative
technology; in future smart transportation, the relationship between cars, software, data, environment, and
ecology, and how car companies and suppliers can better
work together to create future value.
The activities in the intelligent manufacturing and terminal application section are more abundant, including:
Global Intelligent Manufacturing Academy, NEPCON World Hardware Electronics Innovation Conference,
“NEPCON and Smart Factory 1.0 – The Future of Electronic Manufacturing” themed seminar, Internet of
Things Innovation Technology and Application Conference, SiP Micro-assembly industry breakthrough and
innovation summit forum and 5G mobile phone intelligent manufacturing industry chain summit, etc.
Activities in the electronic components and materials section will include, 2021 Domestic Semiconductor Industry High-end
Summit, Innovation and Opportunities, Empowering Domestic Brands – 2021 Bay Area China Piezoelectric
Crystal Information Technology Forum, “Focus on Internet of Things Technology, Insights into Cutting-edge Applications”
Summit Forum, seminar on the road ahead under core shortage, component trading forum, etc.
Attendees will be able to listen closely to the sharing of big names in the industry, communicate with peers in the
industry, recharge themselves, and expand high-quality industry resources for enterprises.
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330103-00-03-10-02-00 | Approach probe | New original
330100-50-05 | Preprocessor sensor | In stock
330100-90-05 | Preprocessor sensor | New original
330100-90-00 | Preprocessor sensor | In stock
3300/16 | Gap dual vibration monitor | In stock
3300/20-12-01-02-01-02 | Dual thrust position monitor | New original
31000-16-10-00-154-00-02 | 31000 close to probe housing | In stock
24765-03-01 | Expansion transducer assembly| New original
24765-02-01 | Enclosure extension transducer assembly | In stock
24765-02-00 | Enclosure extension transducer assembly | New original
24765-01-01 | Vibration monitor | In stock
2300/20-CN | Vibration monitor | New original
2300/20-00-00 | Vibration monitor | In stock
2300/20_KIT-001-00 | Condition monitoring system suite | New original
2300/20_KIT-001-02-00 | Condition monitoring system suite | In stock
2300/20-00 | Vibration monitor | New original
1900/65A-01-01-03-CN-00 | Universal device monitor | In stock
1900/65A-01-00-03-CN-01 | Universal Device monitor | New original
1900/65A-01-00-03-00-01 | Universal device monitor | In stock
1900/65A-00-01-01-CN-00 | Universal device monitor | In stock
1900/65A-00-01-03-00-00 | Universal Device monitor | New original
1900/65A-00-00-01-00-00 | Universal device monitor | In stock
330100-50-05 | Preprocessor sensor | New original
143416-01 | I/O module | In stock
143416-01 | Preprocessor sensor
18745-03 | Preprocessor sensor
177314-02 | Close to system test suite TK-3E
177314-01 | Close to system test suite TK-3E
177313-02-02 | Close to system test suite TK-3E
177313-02-01 | Close to system test suite TK-3E
135613-03-00 | High temperature enclosure expansion transducer assembly
135613-02-00 | High temperature enclosure expansion transducer assembly
177313-01-02 | Access to system test suite
135613-01-00 | High temperature enclosure expansion transducer assembly
2300/20_KIT-001-02-00 | Condition monitoring system suite
135613-01-00 | High temperature enclosure expansion transducer assembly
125840-02 | Ac power input module
126648-01 | External terminal
106M1079-01 | Ac power module
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