Description
hardware flow control. It is an ideal choice in the field of industrial automation.
7. Coating/Developing Equipment: DNS, EV Group, Suss MicroTec, TEL, Shenyang Xinyuan Ningbo Runhua Quanxin
8. Etching/Removal Glue/ashing equipment: Applied Materials, Aviza Technology, Axic, Hitachi High
Technologies Ningbo Runhua Full Core Hefei Zhenping Technology 9. CMP equipment: Applied Materials,
Ebara Corporation, Entrepix, Kinetic Systems, Novellus
10. Electroplating system equipment: Applied Materials, ECI Technology, Novellus, Semitool, Surfect
11. Graphite components/materials for semiconductor processes: POCO Graphite, Carbone Lorraine, TOYO TANSO
12. Packaging and testing equipment: Hangzhou Changchuan, Peride Technology, Shenzhen Nuotai, Shenzhen Fude , Taicang Chenqi, etc.;
13. Water treatment equipment: Shenzhen Pure Water No. 1, Shenzhen Water Vision, Changzhou Veolia, etc.
Mainland China: Northern Huachuang Microelectronics Equipment, China Microelectronics Equipment, Shanghai
Microelectronics Equipment, Tuojing Technology, China Electronics Equipment Group, China Microelectronics,
Seven Star Huachuang, Huahai Qingke, Shennan Circuits, Ruili Science Instruments, Shanghai Microelectronics,
Dayiheng Precision Machinery, Hanmin Technology, Qisheng Machinery Equipment, Shanghai Kangkesi Trading, etc.
4. Wafer foundries
1. International: GlobalFoundries, Samsung (China) Semiconductor Co., Ltd., Tower Jazz, Dongbu, Magna, IBM,
Fujitsu, Intel, SK Hynix Semiconductor (China) Co., Ltd. 2.
China Mainland China and Taiwan: TSMC, UMC, Hejian Technology, Powerchip, SMIC, Huahong Hongli, Demao,
Wuhan Xinxin, Huawei Microelectronics, Huali Microelectronics, Powerchip, Intel Semiconductor (Dalian) Co., Ltd. ,
Xi”an Microelectronics, Jilin Hua Microelectronics
5. Packaging and testing companies
1. International: Amkor, STATS ChipPAC, J-devices, Unisem, Nepes
2. Mainland China and Taiwan: ASE, Licheng, Nanmao, Qi Bang, KYEC Electronics, Fumao, Lingsheng Precision,
Silicon Products, Changdian, Ute, Advanced Semiconductor, Tongfu Microelectronics, Tianshui Huatian,
Nantong Huada Microelectronics, Verizon United Semiconductor, Intel Products (Chengdu) Co., Ltd., Haitai
Semiconductor (Wuxi) Co., Ltd., Jiangsu Xinchao Technology, Amkor Packaging and Testing (Shanghai) Co., Ltd.,
Sandis Semiconductor (Shanghai) Co., Ltd., Lichengliu, IDM 1, International: Intel, Samsung,
Phase
One Carl, Hynix, NEC, NXP, Renesas, STMicroelectronics, TI, Toshiba
2. Mainland: Shanghai Belling, China Resources Microelectronics, Silan Microelectronics
7. Electronic component distributors
1. International: Avnet, Arrow, Future Electronics, WPG, TTI, Macnica, Digi-Key Corporation, Newark Element14,
Mouser Electronics, Fusion Worldwide
2. China: Comtech, China Electronics, Lubicom, Tycoyuan, Weishixin, Patai, Xinheda, Xinzhi, Beijing Gaozhi,
Asiacom8, electronic manufacturing service providers (EMS) 1.
International
: Flextronics, Jabil, Celestica, New Meiya, Baidian, Plexus, Venture Manufacturing, Cooltech, Hicks, Zhuoneng 2, China: Hon Hai,
New Jinbao, Great Wall Development, USI, Huatai, Asustek, Quanta, Inventec, TPV, Wistron
9. Terminal brands
1. International: Apple, Samsung, IBM, Sony, Toshiba, Dell, Fujitsu, NEC, Panasonic, HP
2. China: Huawei, ZTE, lenovo , Xiaomi, OPPO, ASUS, Acer, Shenzhou, Meizu, Coolpad
10, EDA design software manufacturers
1. International: Synopsys, Mentor, Cadence
2. China: Huada Jiutian, Xinhe Technology, Guangli Micro, Boda Micro, Chip Vision, Xcelis, Shengjing Micro, Jiyesi, Xunmei, etc.
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330103-00-03-10-02-00 | Approach probe | New original
330100-50-05 | Preprocessor sensor | In stock
330100-90-05 | Preprocessor sensor | New original
330100-90-00 | Preprocessor sensor | In stock
3300/16 | Gap dual vibration monitor | In stock
3300/20-12-01-02-01-02 | Dual thrust position monitor | New original
31000-16-10-00-154-00-02 | 31000 close to probe housing | In stock
24765-03-01 | Expansion transducer assembly| New original
24765-02-01 | Enclosure extension transducer assembly | In stock
24765-02-00 | Enclosure extension transducer assembly | New original
24765-01-01 | Vibration monitor | In stock
2300/20-CN | Vibration monitor | New original
2300/20-00-00 | Vibration monitor | In stock
2300/20_KIT-001-00 | Condition monitoring system suite | New original
2300/20_KIT-001-02-00 | Condition monitoring system suite | In stock
2300/20-00 | Vibration monitor | New original
1900/65A-01-01-03-CN-00 | Universal device monitor | In stock
1900/65A-01-00-03-CN-01 | Universal Device monitor | New original
1900/65A-01-00-03-00-01 | Universal device monitor | In stock
1900/65A-00-01-01-CN-00 | Universal device monitor | In stock
1900/65A-00-01-03-00-00 | Universal Device monitor | New original
1900/65A-00-00-01-00-00 | Universal device monitor | In stock
330100-50-05 | Preprocessor sensor | New original
143416-01 | I/O module | In stock
143416-01 | Preprocessor sensor
18745-03 | Preprocessor sensor
177314-02 | Close to system test suite TK-3E
177314-01 | Close to system test suite TK-3E
177313-02-02 | Close to system test suite TK-3E
177313-02-01 | Close to system test suite TK-3E
135613-03-00 | High temperature enclosure expansion transducer assembly
135613-02-00 | High temperature enclosure expansion transducer assembly
177313-01-02 | Access to system test suite
135613-01-00 | High temperature enclosure expansion transducer assembly
2300/20_KIT-001-02-00 | Condition monitoring system suite
135613-01-00 | High temperature enclosure expansion transducer assembly
125840-02 | Ac power input module
126648-01 | External terminal
106M1079-01 | Ac power module
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