Description
XT-DVI-D-5-01 Панель сенсорного управления – 7 дюймов
современными требованиями дизайна. Как и XV303, конденсаторный многоточечный сенсорный дисплей поддерживает реализацию
современного пользовательского интерфейса (управление жестами)
и предлагает 7 – и 10 – дюймовые дисплеи, в том числе версии с высоким соотношением сторон 16: 9.
просто и требует меньше компонентов и инженерных работ, чем традиционная проводка. SmartWire – DT интегрирует связь и ввод / вывода
непосредственно в устройства управления, отображения и переключения, открывая новые возможности для инновационных и экономичных решений.
ABB: Запасные части для промышленных роботов серии DSQC, Bailey INFI 90, IGCT, например: 5SHY6545L0001 AC1027001R0101 5SXE10 – 0181, 5SHY3545 L0009, 5SHI3545L0010 3BHB013088 R0001 3BHE009681R0101 GVC750BE101, PM866, PM861K01, PM864, PM510V16, PPD512, PPPD113, PP836A, P865A, 877, PPP881, PPPP885, PPSL500000 4 3BHL00390P0104 5SGY35L4510 и т.д.
General Electric: запасные части, такие как модули, карты и приводы. Например: VMVME – 7807, VMVME – 7750, WES532 – 111, UR6UH, SR469 – P5 – HI – A20, IS230SRTDH2A, IS220PPDAH1B, IS215UCVEH2A, IC698CPE010, IS200SRTDH2ACB и т.д.
Система Bently Nevada: 350 / 3300 / 1900, предохранительные зонды и т.д., например: 3500 / 22M, 3500 / 32, 3500 / 15, 3500 / 23500 / 42M, 1900 / 27 и т.д.
Системы Invis Foxboro: Серия I / A, управление последовательностью FBM, трапециевидное логическое управление, обработка отзыва событий, DAC,
обработка входных / выходных сигналов, передача и обработка данных, такие как FCP270 и FCP280, P0904HA, E69F – TI2 – S, FBM230 / P0926GU, FEM100 / P0973CA и т.д.
Invis Triconex: Модуль питания, модуль CPU, модуль связи, модуль ввода – вывода, например 300830937214351B, 3805E, 831235114355X и т.д.
Вудворд: контроллер местоположения SPC, цифровой контроллер PEAK150, например 8521 – 0312 UG – 10D, 9907 – 149, 9907 – 162, 9907 – 164, 9907 – 167, TG – 13 (8516 – 038), 8440 – 1713 / D, 9907 – 018 2301A, 5466 – 258, 8200 – 226 и т.д.
Hima: модули безопасности, такие как F8650E, F8652X, F8627X, F8678X, F3236, F6217, F6214, Z7138, F8651X, F8650X и т.д.
Honeywell: Все платы DCS, модули, процессоры, такие как: CC – MCAR01, CC – PAIH01, CC – PAIH02, CC – PAIH51, CC – PAIX02, CC – PAON01, CC – PCF901, TC – CR014, TC – PD011, CC – PCNT02 и т.д.
Motorola: серии MVME162, MVME167, MVME172, MVME177, такие как MVME5100, MVME5500 – 0163, VME172PA – 652SE, VME162PA – 344SE – 2G и другие.
Xycom: I / O, платы VME и процессоры, такие как XVME – 530, XVME – 674, XVME – 957, XVME – 976 и т.д.
Коул Морган: Сервоприводы и двигатели, такие как S72402 – NANA, S6201 – 550, S20330 – SRS, CB06551 / PRD – B040SSIB – 63 и т. Д.
Bosch / Luxer / Indramat: модуль ввода / вывода, контроллер PLC, приводной модуль, MSK060C – 0600 – NN – S1 – UP1 – NNN, VT2000 – 52 / R900033828, MHD041B – 144 – PG1 – UN и т.д.
Activities in the automotive electronics sector will include: SAE-AWC 2021 Automotive Electronics Innovation Technology Forum,
“Smart Car “Hundred Forum” Issue 21 – China Automotive Semiconductor Technology Summit Forum”, AWC 2021 Third Automotive
Digital Cockpit Forum wait. At the same time, the China Intelligent Connected Vehicle Industry Summit will invite speakers from
well-known industry companies, research institutions, universities and other industries with advanced technological advantages in the
field of intelligent connected vehicles and new energy vehicles to share their experience in the design, development and production of
intelligent connected vehicles. Problem solving and innovative technology; in future smart transportation, the relationship between cars,
software, data, environment, and ecology, and how car companies and suppliers can better work together to create future value.
The activities in the intelligent manufacturing and terminal application section are more abundant, including: Global Intelligent Manufacturing Academy,
NEPCON World Hardware Electronics Innovation Conference, ” NEPCON and Smart Factory 1.0 – The Future of Electronic Manufacturing” themed seminar,
Internet of Things Innovation Technology and Application Conference, SiP Micro-assembly industry breakthrough and innovation summit forum and 5G mobile
phone intelligent manufacturing industry chain summit, etc.
Activities in the electronic components and materials section will include, 2021 Domestic Semiconductor Industry High-end Summit, Innovation and Opportunities,
Empowering Domestic Brands – 2021 Bay Area China Piezoelectric Crystal Information Technology Forum, “Focus on Internet of Things Technology, Insights into
Cutting-edge Applications” Summit Forum, seminar on the road ahead under core shortage, component trading forum, etc.
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MVI56-PDPMV1 PROSOFT Servo drive driver
FOXBORO P0912XX Control system I/O module
IS200DSFCG1AEB printed circuit board
IS200DSFCG1ADB Feedback drive
IS200DSFCG1A driver GE board
IS200DSFCG1ACA printed circuit board
IS200DSCBH1AAA terminal series andboard
IS200DSCBH1A TB series card
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IS200DRLYH1AED MARK VI GE terminates
IS200DRTDH1A printed circuit board
IS200BICHH1A control board BICH
IS200BAIAH1BCB printed circuit board
IS200AVSCG1A SCR control board
IS200AVIFH1A Bridge interface board
IS200AVGBG1A MARK VI module
IS200ATBAG1AAA I/O board
IS200ATBAG1A I/O terminal board
IS200AEPCH1CCB turbine control module
IS200AEPCH1ABC General Electric board components
IS200AEPCH1A Central module
IS200AEPAH1AFD printed circuit board
IS200AEPAH1AAA turbine control PCB board
IS200AEPAH1A circuit board
IS200AEBMG1AFB analog input module
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