Description
XN-S4T-SBBC Панель сенсорного управления – 7 дюймов
современными требованиями дизайна. Как и XV303, конденсаторный многоточечный сенсорный дисплей поддерживает реализацию
современного пользовательского интерфейса (управление жестами)
и предлагает 7 – и 10 – дюймовые дисплеи, в том числе версии с высоким соотношением сторон 16: 9.
просто и требует меньше компонентов и инженерных работ, чем традиционная проводка. SmartWire – DT интегрирует связь и ввод / вывода
непосредственно в устройства управления, отображения и переключения, открывая новые возможности для инновационных и экономичных решений.
ABB: Запасные части для промышленных роботов серии DSQC, Bailey INFI 90, IGCT, например: 5SHY6545L0001 AC1027001R0101 5SXE10 – 0181, 5SHY3545 L0009, 5SHI3545L0010 3BHB013088 R0001 3BHE009681R0101 GVC750BE101, PM866, PM861K01, PM864, PM510V16, PPD512, PPPD113, PP836A, P865A, 877, PPP881, PPPP885, PPSL500000 4 3BHL00390P0104 5SGY35L4510 и т.д.
General Electric: запасные части, такие как модули, карты и приводы. Например: VMVME – 7807, VMVME – 7750, WES532 – 111, UR6UH, SR469 – P5 – HI – A20, IS230SRTDH2A, IS220PPDAH1B, IS215UCVEH2A, IC698CPE010, IS200SRTDH2ACB и т.д.
Система Bently Nevada: 350 / 3300 / 1900, предохранительные зонды и т.д., например: 3500 / 22M, 3500 / 32, 3500 / 15, 3500 / 23500 / 42M, 1900 / 27 и т.д.
Системы Invis Foxboro: Серия I / A, управление последовательностью FBM, трапециевидное логическое управление, обработка отзыва событий, DAC,
обработка входных / выходных сигналов, передача и обработка данных, такие как FCP270 и FCP280, P0904HA, E69F – TI2 – S, FBM230 / P0926GU, FEM100 / P0973CA и т.д.
Invis Triconex: Модуль питания, модуль CPU, модуль связи, модуль ввода – вывода, например 300830937214351B, 3805E, 831235114355X и т.д.
Вудворд: контроллер местоположения SPC, цифровой контроллер PEAK150, например 8521 – 0312 UG – 10D, 9907 – 149, 9907 – 162, 9907 – 164, 9907 – 167, TG – 13 (8516 – 038), 8440 – 1713 / D, 9907 – 018 2301A, 5466 – 258, 8200 – 226 и т.д.
Hima: модули безопасности, такие как F8650E, F8652X, F8627X, F8678X, F3236, F6217, F6214, Z7138, F8651X, F8650X и т.д.
Honeywell: Все платы DCS, модули, процессоры, такие как: CC – MCAR01, CC – PAIH01, CC – PAIH02, CC – PAIH51, CC – PAIX02, CC – PAON01, CC – PCF901, TC – CR014, TC – PD011, CC – PCNT02 и т.д.
Motorola: серии MVME162, MVME167, MVME172, MVME177, такие как MVME5100, MVME5500 – 0163, VME172PA – 652SE, VME162PA – 344SE – 2G и другие.
Xycom: I / O, платы VME и процессоры, такие как XVME – 530, XVME – 674, XVME – 957, XVME – 976 и т.д.
Коул Морган: Сервоприводы и двигатели, такие как S72402 – NANA, S6201 – 550, S20330 – SRS, CB06551 / PRD – B040SSIB – 63 и т. Д.
Bosch / Luxer / Indramat: модуль ввода / вывода, контроллер PLC, приводной модуль, MSK060C – 0600 – NN – S1 – UP1 – NNN, VT2000 – 52 / R900033828, MHD041B – 144 – PG1 – UN и т.д.
(3)Market size:
(4) Related companies: APC, Emerson Network Power, Kehua Hengsheng
(5) Recommendation index: Recommended
4. Switching power supply
5. Power factor correction technology
6. Application of power electronics technology in power systems
7. LED driver power supply
8. Other applications
[Introduction] 1. IC design companies 1. International: Qualcomm, Broadcom, MediaTek, Nvidia, Marvell, Xilinx, Altera2, Taiwan: mainly MediaTek, Duntai Technology, Elan
Electronics, Egis Technology, Sungyang, VIA et al. 3. Mainland China: Unisoc, ZTE Microelectronics, Duntai, HiSilicon Semiconductor, Quanzhi Technology, Huada
Semiconductor, Datang Semiconductor, Zhixin Microelectronics, National Microelectronics, Vimicro Microelectronics, Unisoc Guoxin, National Technology , Orbit, Zhongying
Electronics, Montage Technology, BeidouStar, Beijing Junzheng, GigaDevice, Geke Microelectronics, China Electronics, Weill Semiconductor, Tongchuang National Chip, Fudan
Microelectronics, Apex Microelectronics, Hui Top Technology, MediaTek, Chipone North, Tongfang Microelectronics, Zhongtian Lianke, Shengbang Microelectronics, etc. 2
. Semiconductor materials companies 1. International: JSRMcroelectronics, ETSC Technologies Co. , SEMI…
1. IC design companies
1. International: Qualcomm, Broadcom, MediaTek, Nvidia, Marvell, Xilinx, Altera
2. Taiwan: Mainly MediaTek, Duntai Technology, Elan Electronics, Egis Technology, Sungyang, VIA, etc. .
3. Mainland China: Unisoc, ZTE Microelectronics, Duntai, HiSilicon Semiconductor , Quanzhi Technology, Huada Semiconductor, Datang Semiconductor, Zhixin
Microelectronics, National Microelectronics, Vimicro Microelectronics, Unisoc Guoxin, National Technology , Orbit, Zhongying Electronics, Montage Technology,
BeidouStar, Beijing Junzheng, GigaDevice, Geke Microelectronics, China Electronics, Weill Semiconductor, Tongchuang National Chip, Fudan Microelectronics,
Apex Microelectronics, Hui Top Technology, MediaTek, Chipone North, Tongfang Microelectronics, Zhongtian Lianke, Shengbang Microelectronics, etc.
2. Semiconductor materials companies
1. International: JSR Microelectronics, ETSC Technologies Co. , SEMI, Air Products, Ablestik, Cadence, Abrasive Technology, Praxair Electronics, TBW Industries,
Applied Materials
2. Mainland China: Tepuco Industrial, Zhejiang Jinruihong, Nanjing Guosheng, Hebei Puxing, Youyan, Shandong University of Science and Technology Dingxin,
Beijing Da Bo, Ningbo Jiangfeng, Youyan Yijin, Shanghai Xinyang, Anji, Zhongneng Silicon Technology, Zhonghuan Semiconductor, Jinglong Group, Xinte Energy,
Xi”an LONGi, China Silicon Hi-Tech, Sunshine Energy, Oridian Optoelectronics, Tianhong Silicon, Shanghai Shenhe Thermal Magnetic (wholly owned by a Japanese
company), Guosheng
Electronics, Jiangfeng Electronic Materials, Youyan Yijin, Beijing Dabo, Shanghai Xinyang, Anji Microelectronics, Youyan New Materials, Hubei Xingfu Electronics,
Jianghua Micro, Jin Ruihong, etc.
3. Semiconductor equipment manufacturing companies
1. Wafer cleaning equipment: Applied Materials, Dainippon Screen (DNS) Changzhou Silicon Micro, Kunshan Zhicheng, Beijing Hualin Jiaye, Suzhou Shimike,
Ningbo Runhua Quanxin, Tianjin Nanxuan, Shandong Jie Sheng et al.
2. Heat treatment equipment: Applied Materials, ASM
3. Ion implantation equipment: Applied Materials
4. CVD/PECVD/ALD equipment:
5. PVD equipment: Applied Materials, Aviza Technology, KDF, Novellus, Oerlikon, Northern Microelectronics
6. Photolithography Equipment: ASML, Canon, EV Group, Molecular Imprints, Nikon Precision, Beijing Jingzhen
7. Coating/Developing Equipment: DNS, EV Group, Suss Mi
Bently Nevada 3300/16-02-01-02-01-00-00 XY/Gap Dual Vibration Monitor
Bently Nevada 3300/16-02-01-00-03-00-00 XY/Gap Dual Vibration Monitor
Bently Nevada 3300/25-05-03-05-01-00-02-00 Dual Accelerometer Monitor
Bently Nevada 3300/16-02-01-00-01-00-00 XY/Gap Dual Vibration Monitor
Bently Nevada 3300 6-Position System Chassis
Bently Nevada 1900/27-01-00 Vibration Monitor
Bently Nevada 330180-51-00 5/8 mm Proximitor Sensor
Bently Nevada 330180-91-00 5/8 mm Proximitor Sensor
Bently Nevada 330101-00-08-10-02-05 3300 XL 8mm Proximity Probe
Bently Nevada 330180-90-05 5/8 mm Proximitor Sensor
Bently Nevada 330180-51-05 5/8 mm Proximitor Sensor
Bently Nevada 330180-90-05 5/8 mm Proximitor Sensor
Bently Nevada 330104-00-03-10-01-05 3300 XL 8 mm Probe
Bently Nevada 330105-02-12-05-02-05 3300 XL 8 mm Reverse Mount Probe
Bently Nevada 330130-045-02-05 3300 XL Standard Extension Cable
Bently Nevada 330180-91-05 5/8 mm Proximitor Sensor
Bently Nevada143729-01 Cylinder Pressure I/O Module with Internal Terminations
Bently Nevada TK15 Keyphasor Conditioner and Power Supply
Bently Nevada 330101-00-20-05-11-05 3300 XL 8 mm Proximity Probe
Bently Nevada 330105-02-12-10-12-05 3300 XL 8 mm Reverse Mount Probe, 3/8-24 UNF Threads
GE / Bently Nevada RK4 Rotor Kit Controller Assembly
Bently Nevada 170180-01-05 FieldMonitor External Transducer I/O Module
Bently Nevada 1701/15 FieldMonitor Proximitor Input Monitor for Radial Vibration and Thrust Position
Bently Nevada 170180-02-05 FieldMonitor External Transducer I/O Module
Bently Nevada 170190 Dual Galvanic Isolator
330100-50-00 Proximitor Sensor
3500/61-01-05 temperature module with initial calibration
Bently Nevada 330100-90-00 Proximitor Sensor
Bently Nevada 3500/25-02-01-05 Phase marking module
3500/60-01-05 Temperature module with initial calibration
Bently Nevada 3500/33-01-05 16-Channel Control Module
3500/42M-01-05 Vibration module with initial calibration
Bently Nevada 3500/40M-01-05 Vibration module with initial calibration
3500/62-03-05 Analog signal module with master calibration
Bently Nevada 3500/42-09-05 Vibration module with master calibration
3500/25-01-05-05 Phase indicator module
Bently Nevada 3500/25-SIL2-01-01-05 Phase indicator module
3500/25-Sil2-02-01-05 Phase marking module
Bently Nevada Communication module 3500/92-04-01-05
3500/33-SIL2-03-05 Relay module
Bently Nevada 3500/61-Sil2-01-05 Temperature module with master calibration
3500/42M-SIL2-09-05 Vibration module with master calibration
3500/60-05 RTD/TC I/O Module with Internal Barries and Internal Terminations
3500/22-01-01-05 Standard Transient Data Interface
3500/15-07-07-05 Low-voltage DC power module
SYN5202-0277 3BHB006715R0277 Automatic dual-channel synchronizing system
3500/05-01-01-05-00-01 System Rack
3500/22-01-01-05 Standard Transient Data Interfac
Bently Nevada 330104-00-04-10-02-00 Proximity Probes
Bently Nevada 330104-00-07-50-02-00 Proximity Probes
Bently Nevada 330905-05-10-10-02-00 NSv Proximity Probes
Bently Nevada 330104-00-07-10-01-00 Proximity Probes
Bently Nevada 330104-00-25-10-01-00 Proximity Probes
Bently Nevada 330851-04-000-020-90-00-00 Proximity Probes
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