Sale!

SNAT605SDB DCS excitation system

Original price was: $1,888.00.Current price is: $1,688.00.

Model:SNAT605SDB

New original warranty for one year

Brand: ABB

Contact person: Mr. Lai

WeChat:17750010683

WhatsApp:+86 17750010683

Email: 3221366881@qq.com

Category:

Description

Product parameters
Model: SNAT605SDB
Brand: ABB
Size: 10cm x 10cm x 30cm
Weight: 1.2KG
Color: White Black
Working voltage: 5V
Working temperature: -10 ℃ to 50 ℃
Communication interface: RS232, RS485, CAN
Product specifications
Support for MODBUS protocol
Support hardware flow control
Using high-speed CMOS devices
Support for data caching
application area
SNAT605SDB is mainly used in the field of industrial automation, such as DCS PLCs, industrial controllers, robots, etc.
SNAT605SDB is mainly used in steel manufacturing, thermal power generation, hydroelectric power generation, glass manufacturing, paper mills, cement factories, petrochemicals
Chemical fiber, pharmaceutical manufacturing, rubber, plastics, ferrous metal food, machine tools, specialized equipment, transportation vehicles, mechanical equipment
Electronic communication equipment, instruments and beverages, tobacco processing, clothing, textiles, leather, wood processing, furniture, printing, etc
Model: SNAT605SDB Brand: ABB Archive Function: Communication Function Product Certification: Qualified
Working voltage: 24V Internal variable: No pattern Type: Vector diagram Applicable range: Industrial type
Number of screens: 4 Imported or not: Yes Customized for processing: No
Alarm function: Product name: Module Input voltage: 24V Rated current: 5A
Special service: including postage. Remarks: one-year warranty. Operation method: remote control
Applicable motor: servo motor system memory: 8MB Display color: 99.9 color gamut
Power voltage: 220V Input method: Current Input Material code: 65218
Communication interface: HDMI interface Working temperature: 60 Material number 26854 Other functions Analog communication
Output frequency: 50HZ Rated voltage: 24V Alarm type: Light alarm
Disconnect capacity: 0.01 Vector graph support: Minimum number of packages supported: 1
Display type: IPS USB interface quantity: 2 interfaces Memory card slot: 2
Panel protection level: 3 Memory expansion capacity: 128MB User script support: supported
Speed response frequency: 1MS Working environment temperature: -40 to 100 Insulation withstand voltage test: Passed
Third party communication products: ABB controllers available for sale in: nationwide
Product Instructions
Please install SNAT605SDB correctly on the device and connect the communication interface cable properly.
Please refer to the user manual for operating SNAT605SDB to ensure proper use.
Product Introduction
SNAT605SDB is a high-performance industrial automation communication module that uses high-speed CMOS devices, supports MODBUS protocol, and supports
hardware flow control. It is an ideal choice in the field of industrial automation.

(3)Market size:

(4) Related companies: APC, Emerson Network Power, Kehua Hengsheng

(5) Recommendation index: Recommended

4. Switching power supply

5. Power factor correction technology

6. Application of power electronics technology in power systems

7. LED driver power supply

8. Other applications
[Introduction] 1. IC design companies 1. International: Qualcomm, Broadcom, MediaTek, Nvidia, Marvell, Xilinx, Altera2, Taiwan: mainly MediaTek, Duntai Technology, Elan
Electronics, Egis Technology, Sungyang, VIA et al. 3. Mainland China: Unisoc, ZTE Microelectronics, Duntai, HiSilicon Semiconductor, Quanzhi Technology, Huada
Semiconductor, Datang Semiconductor, Zhixin Microelectronics, National Microelectronics, Vimicro Microelectronics, Unisoc Guoxin, National Technology , Orbit, Zhongying
Electronics, Montage Technology, BeidouStar, Beijing Junzheng, GigaDevice, Geke Microelectronics, China Electronics, Weill Semiconductor, Tongchuang National Chip, Fudan
Microelectronics, Apex Microelectronics, Hui Top Technology, MediaTek, Chipone North, Tongfang Microelectronics, Zhongtian Lianke, Shengbang Microelectronics, etc. 2
. Semiconductor materials companies 1. International: JSRMcroelectronics, ETSC Technologies Co. , SEMI…

1. IC design companies
1. International: Qualcomm, Broadcom, MediaTek, Nvidia, Marvell, Xilinx, Altera
2. Taiwan: Mainly MediaTek, Duntai Technology, Elan Electronics, Egis Technology, Sungyang, VIA, etc. .
3. Mainland China: Unisoc, ZTE Microelectronics, Duntai, HiSilicon Semiconductor , Quanzhi Technology, Huada Semiconductor, Datang Semiconductor, Zhixin
Microelectronics, National Microelectronics, Vimicro Microelectronics, Unisoc Guoxin, National Technology , Orbit, Zhongying Electronics, Montage Technology,
BeidouStar, Beijing Junzheng, GigaDevice, Geke Microelectronics, China Electronics, Weill Semiconductor, Tongchuang National Chip, Fudan Microelectronics,
Apex Microelectronics, Hui Top Technology, MediaTek, Chipone North, Tongfang Microelectronics, Zhongtian Lianke, Shengbang Microelectronics, etc.
2. Semiconductor materials companies
1. International: JSR Microelectronics, ETSC Technologies Co. , SEMI, Air Products, Ablestik, Cadence, Abrasive Technology, Praxair Electronics, TBW Industries,
Applied Materials
2. Mainland China: Tepuco Industrial, Zhejiang Jinruihong, Nanjing Guosheng, Hebei Puxing, Youyan, Shandong University of Science and Technology Dingxin,
Beijing Da Bo, Ningbo Jiangfeng, Youyan Yijin, Shanghai Xinyang, Anji, Zhongneng Silicon Technology, Zhonghuan Semiconductor, Jinglong Group, Xinte Energy,
Xi”an LONGi, China Silicon Hi-Tech, Sunshine Energy, Oridian Optoelectronics, Tianhong Silicon, Shanghai Shenhe Thermal Magnetic (wholly owned by a Japanese
company), Guosheng
Electronics, Jiangfeng Electronic Materials, Youyan Yijin, Beijing Dabo, Shanghai Xinyang, Anji Microelectronics, Youyan New Materials, Hubei Xingfu Electronics,
Jianghua Micro, Jin Ruihong, etc.
3. Semiconductor equipment manufacturing companies
1. Wafer cleaning equipment: Applied Materials, Dainippon Screen (DNS) Changzhou Silicon Micro, Kunshan Zhicheng, Beijing Hualin Jiaye, Suzhou Shimike,
Ningbo Runhua Quanxin, Tianjin Nanxuan, Shandong Jie Sheng et al.
2. Heat treatment equipment: Applied Materials, ASM
3. Ion implantation equipment: Applied Materials
4. CVD/PECVD/ALD equipment:
5. PVD equipment: Applied Materials, Aviza Technology, KDF, Novellus, Oerlikon, Northern Microelectronics
6. Photolithography Equipment: ASML, Canon, EV Group, Molecular Imprints, Nikon Precision, Beijing Jingzhen
7. Coating/Developing Equipment: DNS, EV Group, Suss Mi

Contact person: Mr. Lai
Mobil:17750010683
WeChat:17750010683
WhatsApp:+86 17750010683
Email: 3221366881@qq.com

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