SD812F 3BDH000014R1 Multifunctional control board

Product parameters

Model: SD812F 3BDH000014R1

Brand: ABB

Size: 10cm x 10cm x 30cm

Weight: 1.2KG

Color: White Black

Working voltage: 5V

Working temperature: -10 ℃ to 50 ℃

Communication interface: RS232, RS485, CAN

Product specifications

Support for MODBUS protocol

Support hardware flow control

Using high-speed CMOS devices

Support for data caching

application area

SD812F 3BDH000014R1 is mainly used in the field of industrial automation, such as DCS PLCs, industrial controllers, robots, etc.

SD812F 3BDH000014R1 is mainly used in steel manufacturing, thermal power generation, hydroelectric power generation, glass manufacturing, paper mills, cement factories, petrochemicals

Chemical fiber, pharmaceutical manufacturing, rubber, plastics, ferrous metal food, machine tools, specialized equipment, transportation vehicles, mechanical equipment

Electronic communication equipment, instruments and beverages, tobacco processing, clothing, textiles, leather, wood processing, furniture, printing, etc

Model: SD812F 3BDH000014R1 Brand: ABB Archive Function: Communication Function Product Certification: Qualified

Working voltage: 24V Internal variable: No pattern Type: Vector diagram Applicable range: Industrial type

Number of screens: 4 Imported or not: Yes Customized for processing: No

Alarm function: Product name: Module Input voltage: 24V Rated current: 5A

Special service: including postage. Remarks: one-year warranty. Operation method: remote control

Applicable motor: servo motor system memory: 8MB Display color: 99.9 color gamut

Power voltage: 220V Input method: Current Input Material code: 65218

Communication interface: HDMI interface Working temperature: 60 Material number 26854 Other functions Analog communication

Output frequency: 50HZ Rated voltage: 24V Alarm type: Light alarm

Disconnect capacity: 0.01 Vector graph support: Minimum number of packages supported: 1

Display type: IPS USB interface quantity: 2 interfaces Memory card slot: 2

Panel protection level: 3 Memory expansion capacity: 128MB User script support: supported

Speed response frequency: 1MS Working environment temperature: -40 to 100 Insulation withstand voltage test: Passed

Third party communication products: ABB controllers available for sale in: nationwide

Product Instructions

Please install SD812F 3BDH000014R1 correctly on the device and connect the communication interface cable properly.

Please refer to the user manual for operating SD812F 3BDH000014R1 to ensure proper use.

Product Introduction

SD812F 3BDH000014R1 is a high-performance industrial automation communication module that uses high-speed CMOS devices, supports MODBUS protocol, and supports
hardware flow control. It is an ideal choice in the field of industrial automation.

7. Coating/Developing Equipment: DNS, EV Group, Suss MicroTec, TEL, Shenyang Xinyuan Ningbo Runhua Quanxin
8. Etching/Removal Glue/ashing equipment: Applied Materials, Aviza Technology, Axic, Hitachi High
Technologies Ningbo Runhua Full Core Hefei Zhenping Technology 9. CMP equipment: Applied Materials,
Ebara Corporation, Entrepix, Kinetic Systems, Novellus
10. Electroplating system equipment: Applied Materials, ECI Technology, Novellus, Semitool, Surfect
11. Graphite components/materials for semiconductor processes: POCO Graphite, Carbone Lorraine, TOYO TANSO
12. Packaging and testing equipment: Hangzhou Changchuan, Peride Technology, Shenzhen Nuotai, Shenzhen Fude , Taicang Chenqi, etc.;
13. Water treatment equipment: Shenzhen Pure Water No. 1, Shenzhen Water Vision, Changzhou Veolia, etc.
Mainland China: Northern Huachuang Microelectronics Equipment, China Microelectronics Equipment, Shanghai
Microelectronics Equipment, Tuojing Technology, China Electronics Equipment Group, China Microelectronics,
Seven Star Huachuang, Huahai Qingke, Shennan Circuits, Ruili Science Instruments, Shanghai Microelectronics,
Dayiheng Precision Machinery, Hanmin Technology, Qisheng Machinery Equipment, Shanghai Kangkesi Trading, etc.
4. Wafer foundries
1. International: GlobalFoundries, Samsung (China) Semiconductor Co., Ltd., Tower Jazz, Dongbu, Magna, IBM,
Fujitsu, Intel, SK Hynix Semiconductor (China) Co., Ltd. 2.
China Mainland China and Taiwan: TSMC, UMC, Hejian Technology, Powerchip, SMIC, Huahong Hongli, Demao,
Wuhan Xinxin, Huawei Microelectronics, Huali Microelectronics, Powerchip, Intel Semiconductor (Dalian) Co., Ltd. ,
Xi”an Microelectronics, Jilin Hua Microelectronics

5. Packaging and testing companies
1. International: Amkor, STATS ChipPAC, J-devices, Unisem, Nepes
2. Mainland China and Taiwan: ASE, Licheng, Nanmao, Qi Bang, KYEC Electronics, Fumao, Lingsheng Precision,
Silicon Products, Changdian, Ute, Advanced Semiconductor, Tongfu Microelectronics, Tianshui Huatian,
Nantong Huada Microelectronics, Verizon United Semiconductor, Intel Products (Chengdu) Co., Ltd., Haitai
Semiconductor (Wuxi) Co., Ltd., Jiangsu Xinchao Technology, Amkor Packaging and Testing (Shanghai) Co., Ltd.,
Sandis Semiconductor (Shanghai) Co., Ltd., Lichengliu, IDM 1, International: Intel, Samsung,
Phase
One Carl, Hynix, NEC, NXP, Renesas, STMicroelectronics, TI, Toshiba
2. Mainland: Shanghai Belling, China Resources Microelectronics, Silan Microelectronics
7. Electronic component distributors
1. International: Avnet, Arrow, Future Electronics, WPG, TTI, Macnica, Digi-Key Corporation, Newark Element14,
Mouser Electronics, Fusion Worldwide
2. China: Comtech, China Electronics, Lubicom, Tycoyuan, Weishixin, Patai, Xinheda, Xinzhi, Beijing Gaozhi,
Asiacom8, electronic manufacturing service providers (EMS) 1.
International
: Flextronics, Jabil, Celestica, New Meiya, Baidian, Plexus, Venture Manufacturing, Cooltech, Hicks, Zhuoneng 2, China: Hon Hai,
New Jinbao, Great Wall Development, USI, Huatai, Asustek, Quanta, Inventec, TPV, Wistron
9. Terminal brands
1. International: Apple, Samsung, IBM, Sony, Toshiba, Dell, Fujitsu, NEC, Panasonic, HP
2. China: Huawei, ZTE, lenovo , Xiaomi, OPPO, ASUS, Acer, Shenzhou, Meizu, Coolpad
10, EDA design software manufacturers
1. International: Synopsys, Mentor, Cadence
2. China: Huada Jiutian, Xinhe Technology, Guangli Micro, Boda Micro, Chip Vision, Xcelis, Shengjing Micro, Jiyesi, Xunmei, etc.

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