Description
hardware flow control. It is an ideal choice in the field of industrial automation.
7. Coating/Developing Equipment: DNS, EV Group, Suss MicroTec, TEL, Shenyang Xinyuan Ningbo Runhua Quanxin
8. Etching/Removal Glue/ashing equipment: Applied Materials, Aviza Technology, Axic, Hitachi High
Technologies Ningbo Runhua Full Core Hefei Zhenping Technology 9. CMP equipment: Applied Materials,
Ebara Corporation, Entrepix, Kinetic Systems, Novellus
10. Electroplating system equipment: Applied Materials, ECI Technology, Novellus, Semitool, Surfect
11. Graphite components/materials for semiconductor processes: POCO Graphite, Carbone Lorraine, TOYO TANSO
12. Packaging and testing equipment: Hangzhou Changchuan, Peride Technology, Shenzhen Nuotai, Shenzhen Fude , Taicang Chenqi, etc.;
13. Water treatment equipment: Shenzhen Pure Water No. 1, Shenzhen Water Vision, Changzhou Veolia, etc.
Mainland China: Northern Huachuang Microelectronics Equipment, China Microelectronics Equipment, Shanghai
Microelectronics Equipment, Tuojing Technology, China Electronics Equipment Group, China Microelectronics,
Seven Star Huachuang, Huahai Qingke, Shennan Circuits, Ruili Science Instruments, Shanghai Microelectronics,
Dayiheng Precision Machinery, Hanmin Technology, Qisheng Machinery Equipment, Shanghai Kangkesi Trading, etc.
4. Wafer foundries
1. International: GlobalFoundries, Samsung (China) Semiconductor Co., Ltd., Tower Jazz, Dongbu, Magna, IBM,
Fujitsu, Intel, SK Hynix Semiconductor (China) Co., Ltd. 2.
China Mainland China and Taiwan: TSMC, UMC, Hejian Technology, Powerchip, SMIC, Huahong Hongli, Demao,
Wuhan Xinxin, Huawei Microelectronics, Huali Microelectronics, Powerchip, Intel Semiconductor (Dalian) Co., Ltd. ,
Xi”an Microelectronics, Jilin Hua Microelectronics
5. Packaging and testing companies
1. International: Amkor, STATS ChipPAC, J-devices, Unisem, Nepes
2. Mainland China and Taiwan: ASE, Licheng, Nanmao, Qi Bang, KYEC Electronics, Fumao, Lingsheng Precision,
Silicon Products, Changdian, Ute, Advanced Semiconductor, Tongfu Microelectronics, Tianshui Huatian,
Nantong Huada Microelectronics, Verizon United Semiconductor, Intel Products (Chengdu) Co., Ltd., Haitai
Semiconductor (Wuxi) Co., Ltd., Jiangsu Xinchao Technology, Amkor Packaging and Testing (Shanghai) Co., Ltd.,
Sandis Semiconductor (Shanghai) Co., Ltd., Lichengliu, IDM 1, International: Intel, Samsung,
Phase
One Carl, Hynix, NEC, NXP, Renesas, STMicroelectronics, TI, Toshiba
2. Mainland: Shanghai Belling, China Resources Microelectronics, Silan Microelectronics
7. Electronic component distributors
1. International: Avnet, Arrow, Future Electronics, WPG, TTI, Macnica, Digi-Key Corporation, Newark Element14,
Mouser Electronics, Fusion Worldwide
2. China: Comtech, China Electronics, Lubicom, Tycoyuan, Weishixin, Patai, Xinheda, Xinzhi, Beijing Gaozhi,
Asiacom8, electronic manufacturing service providers (EMS) 1.
International
: Flextronics, Jabil, Celestica, New Meiya, Baidian, Plexus, Venture Manufacturing, Cooltech, Hicks, Zhuoneng 2, China: Hon Hai,
New Jinbao, Great Wall Development, USI, Huatai, Asustek, Quanta, Inventec, TPV, Wistron
9. Terminal brands
1. International: Apple, Samsung, IBM, Sony, Toshiba, Dell, Fujitsu, NEC, Panasonic, HP
2. China: Huawei, ZTE, lenovo , Xiaomi, OPPO, ASUS, Acer, Shenzhou, Meizu, Coolpad
10, EDA design software manufacturers
1. International: Synopsys, Mentor, Cadence
2. China: Huada Jiutian, Xinhe Technology, Guangli Micro, Boda Micro, Chip Vision, Xcelis, Shengjing Micro, Jiyesi, Xunmei, etc.
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3BHL00386P0101 IGCT module ABB
GVC703AE01 IGCT module ABB
3BHB003387R0101 IGCT module ABB
5SHX0660F0001 IGCT module ABB
5SHX0660F0001 3BHL00386P0101 ABB
5SHX0660F0001 GVC703AE01 ABB
5SHX0660F0001 3BHB003387R0101 ABB
5SHX0660F0001 3BHB003387R0101/3BHL00386P0101
5SHX0660F0001 3BHB003387R0101/GVC703AE01
5SHX0660F0001 3BHB003387R0101/GVC703AE01/3BHL00386P0101
5SHX06F6004 3BHB003387R0101 5SXE05-0151 3BHB003151P104AEND:A
5SHX06F6004 3BHB003387R0101 5SXE05-0151
5SHX06F6004 3BHB003151P104AEND:A ABB
5SHX06F6004 3BHB003387R0101 ABB
3BHB003151P104AEND:A IGCT module ABB
5SXE05-0151 IGCT module ABB
3BHB003387R0101 IGCT module ABB
5SHX06F6004 IGCT module ABB
3BHB003151P IGCT module ABB
GVC703AE01 IGCT module ABB
5SXE05-0151 IGCT module ABB
3BHB003387R0101 IGCT module ABB
5SHX08F4502 IGCT module ABB
5SHX08F4502 3BHB003151P ABB
5SHX08F4502 GVC703AE01 ABB
5SHX08F4502 5SXE05-0151 ABB
5SHX08F4502 3BHB003387R0101 ABB
5SHX08F4502 3BHB003387R0101 3BHB003151P
5SHX08F4502 3BHB003387R0101 GVC703AE01
5SHX08F4502 3BHB003387R0101 5SXE05-0151
5SHX08F4502 3BHB003387R0101 5SXE05-0151 GVC703AE01
5SHX08F4502 3BHB003387R0101 5SXE05-0151 GVC703AE01 3BHB003151P
5SHX1060H0003 3BHE024415R0101 3BHB020538R0001 GVC714A101
5SHX1060H0003 3BHE024415R0101 3BHB020538R0001
5SHX1060H0003 GVC714A101 ABB
5SHX1060H0003 3BHB020538R0001 ABB
5SHX1060H0003 3BHE024415R0101 ABB
GVC714A101 IGCT module ABB
3BHB020538R0001 IGCT module ABB
3BHE024415R0101 IGCT module ABB
5SHX1060H0003 IGCT module ABB
3BHB003023P201AEND:B IGCT module
5SXE05-0152 IGCT module ABB
3BHB003230R0101 IGCT module ABB
5SHX10H6004 IGCT module ABB
5SHX10H6004 5SXE05-0152 ABB
5SHX10H6004 3BHB003023P201AEND:B ABB
5SHX10H6004 3BHB003230R0101 ABB
5SHX10H6004 3BHB003230R0101 3BHB003023P201AEND:B
5SHX10H6004 3BHB003230R0101 5SXE05-0152
5SHX10H6004 3BHB003230R0101 5SXE05-0152 3BHB003023P201AEND:B
5SHX1445H0001 3BHL000391P0101 3BHB003230R0101 5SXE05-0152
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