MU-PLAM02 51304362-100 Power module Honeywell

Product parameters

Model: MU-PLAM02 51304362-100

Brand: Honeywell

Size: 10cm x 10cm x 30cm

Weight: 1.2KG

Color: White Black

Working voltage: 5V

Working temperature: -10 ℃ to 50 ℃

Communication interface: RS232, RS485, CAN

Product specifications

Support for MODBUS protocol

Support hardware flow control

Using high-speed CMOS devices

Support for data caching

application area

MU-PLAM02 51304362-100 is mainly used in the field of industrial automation, such as DCS PLCs, industrial controllers, robots, etc.

MU-PLAM02 51304362-100 is mainly used in steel manufacturing, thermal power generation, hydroelectric power generation, glass manufacturing, paper mills, cement factories, petrochemicals

Chemical fiber, pharmaceutical manufacturing, rubber, plastics, ferrous metal food, machine tools, specialized equipment, transportation vehicles, mechanical equipment

Electronic communication equipment, instruments and beverages, tobacco processing, clothing, textiles, leather, wood processing, furniture, printing, etc

Model: MU-PLAM02 51304362-100 Brand: ABB Archive Function: Communication Function Product Certification: Qualified

Working voltage: 24V Internal variable: No pattern Type: Vector diagram Applicable range: Industrial type

Number of screens: 4 Imported or not: Yes Customized for processing: No

Alarm function: Product name: Module Input voltage: 24V Rated current: 5A

Special service: including postage. Remarks: one-year warranty. Operation method: remote control

Applicable motor: servo motor system memory: 8MB Display color: 99.9 color gamut

Power voltage: 220V Input method: Current Input Material code: 65218

Communication interface: HDMI interface Working temperature: 60 Material number 26854 Other functions Analog communication

Output frequency: 50HZ Rated voltage: 24V Alarm type: Light alarm

Disconnect capacity: 0.01 Vector graph support: Minimum number of packages supported: 1

Display type: IPS USB interface quantity: 2 interfaces Memory card slot: 2

Panel protection level: 3 Memory expansion capacity: 128MB User script support: supported

Speed response frequency: 1MS Working environment temperature: -40 to 100 Insulation withstand voltage test: Passed

Third party communication products: ABB controllers available for sale in: nationwide

Product Instructions

Please install MU-PLAM02 51304362-100 correctly on the device and connect the communication interface cable properly.

Please refer to the user manual for operating MU-PLAM02 51304362-100 to ensure proper use.

Product Introduction

MU-PLAM02 51304362-100 is a high-performance industrial automation communication module that uses high-speed CMOS devices, supports MODBUS protocol, and supports
hardware flow control. It is an ideal choice in the field of industrial automation.

Activities in the automotive electronics sector will include: SAE-AWC 2021 Automotive Electronics Innovation Technology Forum,
“Smart Car “Hundred Forum” Issue 21 – China Automotive Semiconductor Technology Summit Forum”, AWC 2021 Third Automotive
Digital Cockpit Forum wait. At the same time, the China Intelligent Connected Vehicle Industry Summit will invite speakers from
well-known industry companies, research institutions, universities and other industries with advanced technological advantages in the
field of intelligent connected vehicles and new energy vehicles to share their experience in the design, development and production of
intelligent connected vehicles. Problem solving and innovative technology; in future smart transportation, the relationship between cars,
software, data, environment, and ecology, and how car companies and suppliers can better work together to create future value.

The activities in the intelligent manufacturing and terminal application section are more abundant, including: Global Intelligent Manufacturing Academy,
NEPCON World Hardware Electronics Innovation Conference, ” NEPCON and Smart Factory 1.0 – The Future of Electronic Manufacturing” themed seminar,
Internet of Things Innovation Technology and Application Conference, SiP Micro-assembly industry breakthrough and innovation summit forum and 5G mobile
phone intelligent manufacturing industry chain summit, etc.

Activities in the electronic components and materials section will include, 2021 Domestic Semiconductor Industry High-end Summit, Innovation and Opportunities,
Empowering Domestic Brands – 2021 Bay Area China Piezoelectric Crystal Information Technology Forum, “Focus on Internet of Things Technology, Insights into
Cutting-edge Applications” Summit Forum, seminar on the road ahead under core shortage, component trading forum, etc.

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