Contact person: Mr. Lai
Mobil：17750010683
WeChat：17750010683
WhatsApp：+86 17750010683
7. Coating/Developing Equipment: DNS, EV Group, Suss MicroTec, TEL, Shenyang Xinyuan Ningbo Runhua Quanxin
8. Etching/Removal Glue/ashing equipment: Applied Materials, Aviza Technology, Axic, Hitachi High
Technologies Ningbo Runhua Full Core Hefei Zhenping Technology 9. CMP equipment: Applied Materials,
Ebara Corporation, Entrepix, Kinetic Systems, Novellus
10. Electroplating system equipment: Applied Materials, ECI Technology, Novellus, Semitool, Surfect
11. Graphite components/materials for semiconductor processes: POCO Graphite, Carbone Lorraine, TOYO TANSO
12. Packaging and testing equipment: Hangzhou Changchuan, Peride Technology, Shenzhen Nuotai, Shenzhen Fude , Taicang Chenqi, etc.;
13. Water treatment equipment: Shenzhen Pure Water No. 1, Shenzhen Water Vision, Changzhou Veolia, etc.
Mainland China: Northern Huachuang Microelectronics Equipment, China Microelectronics Equipment, Shanghai
Microelectronics Equipment, Tuojing Technology, China Electronics Equipment Group, China Microelectronics,
Seven Star Huachuang, Huahai Qingke, Shennan Circuits, Ruili Science Instruments, Shanghai Microelectronics,
Dayiheng Precision Machinery, Hanmin Technology, Qisheng Machinery Equipment, Shanghai Kangkesi Trading, etc.
4. Wafer foundries
1. International: GlobalFoundries, Samsung (China) Semiconductor Co., Ltd., Tower Jazz, Dongbu, Magna, IBM,
Fujitsu, Intel, SK Hynix Semiconductor (China) Co., Ltd. 2.
China Mainland China and Taiwan: TSMC, UMC, Hejian Technology, Powerchip, SMIC, Huahong Hongli, Demao,
Wuhan Xinxin, Huawei Microelectronics, Huali Microelectronics, Powerchip, Intel Semiconductor (Dalian) Co., Ltd. ,
Xi”an Microelectronics, Jilin Hua Microelectronics
5. Packaging and testing companies
1. International: Amkor, STATS ChipPAC, J-devices, Unisem, Nepes
2. Mainland China and Taiwan: ASE, Licheng, Nanmao, Qi Bang, KYEC Electronics, Fumao, Lingsheng Precision,
Silicon Products, Changdian, Ute, Advanced Semiconductor, Tongfu Microelectronics, Tianshui Huatian,
Nantong Huada Microelectronics, Verizon United Semiconductor, Intel Products (Chengdu) Co., Ltd., Haitai
Semiconductor (Wuxi) Co., Ltd., Jiangsu Xinchao Technology, Amkor Packaging and Testing (Shanghai) Co., Ltd.,
Sandis Semiconductor (Shanghai) Co., Ltd., Lichengliu, IDM 1, International: Intel, Samsung,
Phase
One Carl, Hynix, NEC, NXP, Renesas, STMicroelectronics, TI, Toshiba
2. Mainland: Shanghai Belling, China Resources Microelectronics, Silan Microelectronics
7. Electronic component distributors
1. International: Avnet, Arrow, Future Electronics, WPG, TTI, Macnica, Digi-Key Corporation, Newark Element14,
Mouser Electronics, Fusion Worldwide
2. China: Comtech, China Electronics, Lubicom, Tycoyuan, Weishixin, Patai, Xinheda, Xinzhi, Beijing Gaozhi,
Asiacom8, electronic manufacturing service providers (EMS) 1.
International
: Flextronics, Jabil, Celestica, New Meiya, Baidian, Plexus, Venture Manufacturing, Cooltech, Hicks, Zhuoneng 2, China: Hon Hai,
New Jinbao, Great Wall Development, USI, Huatai, Asustek, Quanta, Inventec, TPV, Wistron
9. Terminal brands
1. International: Apple, Samsung, IBM, Sony, Toshiba, Dell, Fujitsu, NEC, Panasonic, HP
2. China: Huawei, ZTE, lenovo , Xiaomi, OPPO, ASUS, Acer, Shenzhou, Meizu, Coolpad
10, EDA design software manufacturers
1. International: Synopsys, Mentor, Cadence
2. China: Huada Jiutian, Xinhe Technology, Guangli Micro, Boda Micro, Chip Vision, Xcelis, Shengjing Micro, Jiyesi, Xunmei, etc.
GDB021BE05 HIEE300766R0005 ABB
GCD207B101 3BHE024642R0101 ABB
3BHE024642R0101 control module ABB
GCD207B101 control module ABB
3BHE033068P106REV.B control module
3BHE033067R0103 control module ABB
GCC960C103 control module ABB
GCC960C103 3BHE033068P106REV.B ABB
GCC960C103 3BHE033067R0103 ABB
GCC960C103 3BHE033067R0103/3BHE033068P106REV.B
GCC960C102 3BHE033067E0102/3BHE033068P106REV.B
GCC960C102 3BHE033068P106REV.B ABB
GCC960C102 3BHE033067E0102 ABB
3BHE033068P106REV.B I/O module ABB
3BHE033067E0102 I/O module ABB
GCC960C102 I/O module ABB
FS450R12KE3/AGDR-71C I/O module ABB
FPX86-9329–C I/O module ABB
HIEE45116R0001 I/O module ABB
FM9925A-E I/O module ABB
FM9925A-E HIEE45116R0001 ABB
FI840F 3BDH000033R1 ABB
3BDH000033R1 I/O module ABB
FI840F I/O module ABB
FI830F I/O module ABB
FI820F 3BDH000031R1 ABB
3BDH000031R1 Analog output board ABB
FI820F Analog output board ABB
FET3251C0P184C0H2 Analog output board
FENA-11 Analog output board ABB
FC95-22 HESG440295R2 HESG448688R22
FC95-22 HESG448688R22 ABB
FC95-22 HESG440295R2 ABB
HESG448688R22 Analog output board ABB
HESG440295R2 Analog output board ABB
FC95-22 Analog output board ABB
FAU810 Analog output board ABB
F362 Analog output board ABB
EL3040 0240289352/1100 ABB
0240289352/1100 Analog output board ABB
EL3040 Analog output board ABB
3BDH000022R1 Analog output board ABB
EI813F Analog output board ABB
EI813F 3BDH000022R1 ABB
EI803F 3BDH000017R1 ABB
3BDH000017R1 Analog output board ABB
EI803F Analog output board ABB
EI802F Analog output board ABB
EHDB280 temperature controller ABB
61430001-UW DTCC901B ABB
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