7. Coating/Developing Equipment: DNS, EV Group, Suss MicroTec, TEL, Shenyang Xinyuan Ningbo Runhua Quanxin
8. Etching/Removal Glue/ashing equipment: Applied Materials, Aviza Technology, Axic, Hitachi High
Technologies Ningbo Runhua Full Core Hefei Zhenping Technology 9. CMP equipment: Applied Materials,
Ebara Corporation, Entrepix, Kinetic Systems, Novellus
10. Electroplating system equipment: Applied Materials, ECI Technology, Novellus, Semitool, Surfect
11. Graphite components/materials for semiconductor processes: POCO Graphite, Carbone Lorraine, TOYO TANSO
12. Packaging and testing equipment: Hangzhou Changchuan, Peride Technology, Shenzhen Nuotai, Shenzhen Fude , Taicang Chenqi, etc.;
13. Water treatment equipment: Shenzhen Pure Water No. 1, Shenzhen Water Vision, Changzhou Veolia, etc.
Mainland China: Northern Huachuang Microelectronics Equipment, China Microelectronics Equipment, Shanghai
Microelectronics Equipment, Tuojing Technology, China Electronics Equipment Group, China Microelectronics,
Seven Star Huachuang, Huahai Qingke, Shennan Circuits, Ruili Science Instruments, Shanghai Microelectronics,
Dayiheng Precision Machinery, Hanmin Technology, Qisheng Machinery Equipment, Shanghai Kangkesi Trading, etc.
4. Wafer foundries
1. International: GlobalFoundries, Samsung (China) Semiconductor Co., Ltd., Tower Jazz, Dongbu, Magna, IBM,
Fujitsu, Intel, SK Hynix Semiconductor (China) Co., Ltd. 2.
China Mainland China and Taiwan: TSMC, UMC, Hejian Technology, Powerchip, SMIC, Huahong Hongli, Demao,
Wuhan Xinxin, Huawei Microelectronics, Huali Microelectronics, Powerchip, Intel Semiconductor (Dalian) Co., Ltd. ,
Xi”an Microelectronics, Jilin Hua Microelectronics
5. Packaging and testing companies
1. International: Amkor, STATS ChipPAC, J-devices, Unisem, Nepes
2. Mainland China and Taiwan: ASE, Licheng, Nanmao, Qi Bang, KYEC Electronics, Fumao, Lingsheng Precision,
Silicon Products, Changdian, Ute, Advanced Semiconductor, Tongfu Microelectronics, Tianshui Huatian,
Nantong Huada Microelectronics, Verizon United Semiconductor, Intel Products (Chengdu) Co., Ltd., Haitai
Semiconductor (Wuxi) Co., Ltd., Jiangsu Xinchao Technology, Amkor Packaging and Testing (Shanghai) Co., Ltd.,
Sandis Semiconductor (Shanghai) Co., Ltd., Lichengliu, IDM 1, International: Intel, Samsung,
Phase
One Carl, Hynix, NEC, NXP, Renesas, STMicroelectronics, TI, Toshiba
2. Mainland: Shanghai Belling, China Resources Microelectronics, Silan Microelectronics
7. Electronic component distributors
1. International: Avnet, Arrow, Future Electronics, WPG, TTI, Macnica, Digi-Key Corporation, Newark Element14,
Mouser Electronics, Fusion Worldwide
2. China: Comtech, China Electronics, Lubicom, Tycoyuan, Weishixin, Patai, Xinheda, Xinzhi, Beijing Gaozhi,
Asiacom8, electronic manufacturing service providers (EMS) 1.
International
: Flextronics, Jabil, Celestica, New Meiya, Baidian, Plexus, Venture Manufacturing, Cooltech, Hicks, Zhuoneng 2, China: Hon Hai,
New Jinbao, Great Wall Development, USI, Huatai, Asustek, Quanta, Inventec, TPV, Wistron
9. Terminal brands
1. International: Apple, Samsung, IBM, Sony, Toshiba, Dell, Fujitsu, NEC, Panasonic, HP
2. China: Huawei, ZTE, lenovo , Xiaomi, OPPO, ASUS, Acer, Shenzhou, Meizu, Coolpad
10, EDA design software manufacturers
1. International: Synopsys, Mentor, Cadence
2. China: Huada Jiutian, Xinhe Technology, Guangli Micro, Boda Micro, Chip Vision, Xcelis, Shengjing Micro, Jiyesi, Xunmei, etc.
05701-A-0361 Backplane Serial communication controller and monitor
810-800081-022 LAM Circuit board module
05074-A-0122 05704-A-0121 05704-A-0131 Relay interface card
810-066590-004 LAM Circuit board module
T8403C Trusted TMR 24Vdc digital input module
05701-A-0325 DC input card
T9110 AADvance controller
T9451 AADvance controller Controller module
T9402 AADvance controller
T8311 Trusted TMR expander Interface
T8151B Trusted ® Communication Interface Adapter
T8310 Trusted TMR expander Interface
05704-A-0145 Four-channel controller card 4-20 MA input
GE IS215VCMIH2BB IS200VCMIH2BCC Mark VI System board components
E1740A Agilent Time interval analyzer
GE IS215VCMIH2CA IS200VCMIH2CAA VME communication card
E1406A Agilent Time interval analyzer
05704-A-0144 Four channel control card catalytic input
FBM233 P0926GX FBM233 Field device system integration module
IS420UCSBH1A Mark VIe series UCSB controller
DDC779BE02 3BHE006805R0002 Control panel and control system
MMS6120 Dual channel bearing vibration measurement module MMS 6120
24765-02-01 Housing expansion sensor assembly
CI526 3BSE006085R1 Interface Module
3BSE005831R1 PM632 Processor Unit
3BSE004773R1 CS513K02 MasterBus 300E communication interface
PU512V1 3BSE004736R1 Real Time Accelerator (RTA) Module
3BSE004726R1 DSTD197 Connection Unit 8 ch, 120V
3BSE004723R1 DSTD190 Connection Unit 32 Ch
3BSE004382R1 DSRF185 ABB
DSDX180 3BSE003859R1 Digital In / Out Module
3BSE003832R1 SC510 Submodule Carrier without CPU
3BSE003829R1 CI532V04 AC410 » Communication Modules
3BSE003827R1 CI532V02 MODBUS Interface, 2 ch
SA167 3BSE003390R1 Power Supply Unit AC 115V / DC
SA168 3BSE003389R1 Power Supply Unit
07KR51-230VAC 1SBP260511R1001 Controller Basic Unit
07KP93 GJR5253200R1161 Communication Processor
ABB 07KP90 GJR5251000R0303 Communications Module
07KP53 1SBP260162R1001 MODBUS Coupler (07KP53)
07DC92 GJR5252200R0101 Configurable Digital I/O Module
07DC91 GJR5251400R0202 Digital I/O module
07CR41-c12 1SBP260020R1001 Advant Controller Basic Unit
07CR41 1SBP260020R1001 07CR41 Advant Controller Basic Unit – 24VDC
07AI91 GJR5251600R0202 Analog I/O, module
07AC91 GJR5252300R0101 ABB Advant OCS Analog I/O Unit
HIEE320693R0001 NU8976A Power module
HIER466665R0099 NU8976A99 Excitation module
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