Description
DS200CPCAG1A General Electric Processor Board Mark VI
The activities in the intelligent manufacturing and terminal application section are more abundant, including:
Global Intelligent Manufacturing Academy, NEPCON World Hardware Electronics Innovation Conference,
“NEPCON and Smart Factory 1.0 – The Future of Electronic Manufacturing” themed seminar, Internet of
Things Innovation Technology and Application Conference, SiP Micro-assembly industry breakthrough and
innovation summit forum and 5G mobile phone intelligent manufacturing industry chain summit, etc.
Activities in the electronic components and materials section will include, 2021 Domestic Semiconductor Industry High-end
Summit, Innovation and Opportunities, Empowering Domestic Brands – 2021 Bay Area China Piezoelectric
Crystal Information Technology Forum, “Focus on Internet of Things Technology, Insights into Cutting-edge Applications”
Summit Forum, seminar on the road ahead under core shortage, component trading forum, etc.
Attendees will be able to listen closely to the sharing of big names in the industry, communicate with peers in the
industry, recharge themselves, and expand high-quality industry resources for enterprises.
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