DDC779BE02 3BHE006805R0002 DCS excitation system

Product parameters

Model: DDC779BE02 3BHE006805R0002

Brand: ABB

Size: 10cm x 10cm x 30cm

Weight: 1.2KG

Color: White Black

Working voltage: 5V

Working temperature: -10 ℃ to 50 ℃

Communication interface: RS232, RS485, CAN

Product specifications

Support for MODBUS protocol

Support hardware flow control

Using high-speed CMOS devices

Support for data caching

application area

DDC779BE02 3BHE006805R0002 is mainly used in the field of industrial automation, such as DCS PLCs, industrial controllers, robots, etc.

DDC779BE02 3BHE006805R0002 is mainly used in steel manufacturing, thermal power generation, hydroelectric power generation, glass manufacturing, paper mills, cement factories, petrochemicals

Chemical fiber, pharmaceutical manufacturing, rubber, plastics, ferrous metal food, machine tools, specialized equipment, transportation vehicles, mechanical equipment

Electronic communication equipment, instruments and beverages, tobacco processing, clothing, textiles, leather, wood processing, furniture, printing, etc

Model: DDC779BE02 3BHE006805R0002 Brand: ABB Archive Function: Communication Function Product Certification: Qualified

Working voltage: 24V Internal variable: No pattern Type: Vector diagram Applicable range: Industrial type

Number of screens: 4 Imported or not: Yes Customized for processing: No

Alarm function: Product name: Module Input voltage: 24V Rated current: 5A

Special service: including postage. Remarks: one-year warranty. Operation method: remote control

Applicable motor: servo motor system memory: 8MB Display color: 99.9 color gamut

Power voltage: 220V Input method: Current Input Material code: 65218

Communication interface: HDMI interface Working temperature: 60 Material number 26854 Other functions Analog communication

Output frequency: 50HZ Rated voltage: 24V Alarm type: Light alarm

Disconnect capacity: 0.01 Vector graph support: Minimum number of packages supported: 1

Display type: IPS USB interface quantity: 2 interfaces Memory card slot: 2

Panel protection level: 3 Memory expansion capacity: 128MB User script support: supported

Speed response frequency: 1MS Working environment temperature: -40 to 100 Insulation withstand voltage test: Passed

Third party communication products: ABB controllers available for sale in: nationwide

Product Instructions

Please install DDC779BE02 3BHE006805R0002 correctly on the device and connect the communication interface cable properly.

Please refer to the user manual for operating DDC779BE02 3BHE006805R0002 to ensure proper use.

Product Introduction

DDC779BE02 3BHE006805R0002 is a high-performance industrial automation communication module that uses high-speed CMOS devices, supports MODBUS protocol, and supports
hardware flow control. It is an ideal choice in the field of industrial automation.

(3)Market size:

(4) Related companies: APC, Emerson Network Power, Kehua Hengsheng

(5) Recommendation index: Recommended

4. Switching power supply

5. Power factor correction technology

6. Application of power electronics technology in power systems

7. LED driver power supply

8. Other applications
[Introduction] 1. IC design companies 1. International: Qualcomm, Broadcom, MediaTek, Nvidia, Marvell, Xilinx, Altera2, Taiwan: mainly MediaTek, Duntai Technology, Elan
Electronics, Egis Technology, Sungyang, VIA et al. 3. Mainland China: Unisoc, ZTE Microelectronics, Duntai, HiSilicon Semiconductor, Quanzhi Technology, Huada
Semiconductor, Datang Semiconductor, Zhixin Microelectronics, National Microelectronics, Vimicro Microelectronics, Unisoc Guoxin, National Technology , Orbit, Zhongying
Electronics, Montage Technology, BeidouStar, Beijing Junzheng, GigaDevice, Geke Microelectronics, China Electronics, Weill Semiconductor, Tongchuang National Chip, Fudan
Microelectronics, Apex Microelectronics, Hui Top Technology, MediaTek, Chipone North, Tongfang Microelectronics, Zhongtian Lianke, Shengbang Microelectronics, etc. 2
. Semiconductor materials companies 1. International: JSRMcroelectronics, ETSC Technologies Co. , SEMI…

1. IC design companies
1. International: Qualcomm, Broadcom, MediaTek, Nvidia, Marvell, Xilinx, Altera
2. Taiwan: Mainly MediaTek, Duntai Technology, Elan Electronics, Egis Technology, Sungyang, VIA, etc. .
3. Mainland China: Unisoc, ZTE Microelectronics, Duntai, HiSilicon Semiconductor , Quanzhi Technology, Huada Semiconductor, Datang Semiconductor, Zhixin
Microelectronics, National Microelectronics, Vimicro Microelectronics, Unisoc Guoxin, National Technology , Orbit, Zhongying Electronics, Montage Technology,
BeidouStar, Beijing Junzheng, GigaDevice, Geke Microelectronics, China Electronics, Weill Semiconductor, Tongchuang National Chip, Fudan Microelectronics,
Apex Microelectronics, Hui Top Technology, MediaTek, Chipone North, Tongfang Microelectronics, Zhongtian Lianke, Shengbang Microelectronics, etc.
2. Semiconductor materials companies
1. International: JSR Microelectronics, ETSC Technologies Co. , SEMI, Air Products, Ablestik, Cadence, Abrasive Technology, Praxair Electronics, TBW Industries,
Applied Materials
2. Mainland China: Tepuco Industrial, Zhejiang Jinruihong, Nanjing Guosheng, Hebei Puxing, Youyan, Shandong University of Science and Technology Dingxin,
Beijing Da Bo, Ningbo Jiangfeng, Youyan Yijin, Shanghai Xinyang, Anji, Zhongneng Silicon Technology, Zhonghuan Semiconductor, Jinglong Group, Xinte Energy,
Xi”an LONGi, China Silicon Hi-Tech, Sunshine Energy, Oridian Optoelectronics, Tianhong Silicon, Shanghai Shenhe Thermal Magnetic (wholly owned by a Japanese
company), Guosheng
Electronics, Jiangfeng Electronic Materials, Youyan Yijin, Beijing Dabo, Shanghai Xinyang, Anji Microelectronics, Youyan New Materials, Hubei Xingfu Electronics,
Jianghua Micro, Jin Ruihong, etc.
3. Semiconductor equipment manufacturing companies
1. Wafer cleaning equipment: Applied Materials, Dainippon Screen (DNS) Changzhou Silicon Micro, Kunshan Zhicheng, Beijing Hualin Jiaye, Suzhou Shimike,
Ningbo Runhua Quanxin, Tianjin Nanxuan, Shandong Jie Sheng et al.
2. Heat treatment equipment: Applied Materials, ASM
3. Ion implantation equipment: Applied Materials
4. CVD/PECVD/ALD equipment:
5. PVD equipment: Applied Materials, Aviza Technology, KDF, Novellus, Oerlikon, Northern Microelectronics
6. Photolithography Equipment: ASML, Canon, EV Group, Molecular Imprints, Nikon Precision, Beijing Jingzhen
7. Coating/Developing Equipment: DNS, EV Group, Suss Mi

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