Sale!

3BDH000741R1 simulation module

Original price was: $1,888.00.Current price is: $1,688.00.

Model:3BDH000741R1

New original warranty for one year

Brand: ABB

Contact person: Mr. Lai

WeChat:17750010683

WhatsApp:+86 17750010683

Email: 3221366881@qq.com

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Description

Product parameters
Model: 3BDH000741R1
Brand: ABB
Size: 10cm x 10cm x 30cm
Weight: 1.2KG
Color: White Black
Working voltage: 5V
Working temperature: -10 ℃ to 50 ℃
Communication interface: RS232, RS485, CAN
Product specifications
Support for MODBUS protocol
Support hardware flow control
Using high-speed CMOS devices
Support for data caching
application area
3BDH000741R1 is mainly used in the field of industrial automation, such as DCS PLCs, industrial controllers, robots, etc.
3BDH000741R1 is mainly used in steel manufacturing, thermal power generation, hydroelectric power generation, glass manufacturing, paper mills, cement factories, petrochemicals
Chemical fiber, pharmaceutical manufacturing, rubber, plastics, ferrous metal food, machine tools, specialized equipment, transportation vehicles, mechanical equipment
Electronic communication equipment, instruments and beverages, tobacco processing, clothing, textiles, leather, wood processing, furniture, printing, etc
Model: 3BDH000741R1 Brand: ABB Archive Function: Communication Function Product Certification: Qualified
Working voltage: 24V Internal variable: No pattern Type: Vector diagram Applicable range: Industrial type
Number of screens: 4 Imported or not: Yes Customized for processing: No
Alarm function: Product name: Module Input voltage: 24V Rated current: 5A
Special service: including postage. Remarks: one-year warranty. Operation method: remote control
Applicable motor: servo motor system memory: 8MB Display color: 99.9 color gamut
Power voltage: 220V Input method: Current Input Material code: 65218
Communication interface: HDMI interface Working temperature: 60 Material number 26854 Other functions Analog communication
Output frequency: 50HZ Rated voltage: 24V Alarm type: Light alarm
Disconnect capacity: 0.01 Vector graph support: Minimum number of packages supported: 1
Display type: IPS USB interface quantity: 2 interfaces Memory card slot: 2
Panel protection level: 3 Memory expansion capacity: 128MB User script support: supported
Speed response frequency: 1MS Working environment temperature: -40 to 100 Insulation withstand voltage test: Passed
Third party communication products: ABB controllers available for sale in: nationwide
Product Instructions
Please install 3BDH000741R1 correctly on the device and connect the communication interface cable properly.
Please refer to the user manual for operating 3BDH000741R1 to ensure proper use.
Product Introduction
3BDH000741R1 is a high-performance industrial automation communication module that uses high-speed CMOS devices, supports MODBUS protocol, and supports
hardware flow control. It is an ideal choice in the field of industrial automation.

Activities in the automotive electronics sector will include: SAE-AWC 2021 Automotive Electronics Innovation Technology Forum,
“Smart Car “Hundred Forum” Issue 21 – China Automotive Semiconductor Technology Summit Forum”, AWC 2021 Third Automotive
Digital Cockpit Forum wait. At the same time, the China Intelligent Connected Vehicle Industry Summit will invite speakers from
well-known industry companies, research institutions, universities and other industries with advanced technological advantages in the
field of intelligent connected vehicles and new energy vehicles to share their experience in the design, development and production of
intelligent connected vehicles. Problem solving and innovative technology; in future smart transportation, the relationship between cars,
software, data, environment, and ecology, and how car companies and suppliers can better work together to create future value.

The activities in the intelligent manufacturing and terminal application section are more abundant, including: Global Intelligent Manufacturing Academy,
NEPCON World Hardware Electronics Innovation Conference, ” NEPCON and Smart Factory 1.0 – The Future of Electronic Manufacturing” themed seminar,
Internet of Things Innovation Technology and Application Conference, SiP Micro-assembly industry breakthrough and innovation summit forum and 5G mobile
phone intelligent manufacturing industry chain summit, etc.

Activities in the electronic components and materials section will include, 2021 Domestic Semiconductor Industry High-end Summit, Innovation and Opportunities,
Empowering Domestic Brands – 2021 Bay Area China Piezoelectric Crystal Information Technology Forum, “Focus on Internet of Things Technology, Insights into
Cutting-edge Applications” Summit Forum, seminar on the road ahead under core shortage, component trading forum, etc.

Contact person: Mr. Lai
Mobil:17750010683
WeChat:17750010683
WhatsApp:+86 17750010683
Email: 3221366881@qq.com

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