Description
3BDH000741R1 CTI 21-P Ex Модуль ввода / вывода ABB
Швейцария, и входит в десятку крупнейших швейцарских транснациональных корпораций.3BDH000741R1 CTI 21-P Ex
химическая, нефтехимическая, фармацевтическая, целлюлозно – бумажная, нефтепереработка; Оборудование приборов: электронные приборы, телевизоры и оборудование для передачи данных,
генераторы, гидротехнические сооружения; Каналы связи: интегрированные системы, системы сбора и распространения;3BDH000741R1 CTI 21-P ExСтроительная промышленность: коммерческое и промышленное строительство.
7. Coating/Developing Equipment: DNS, EV Group, Suss MicroTec, TEL, Shenyang Xinyuan Ningbo Runhua Quanxin
8. Etching/Removal Glue/ashing equipment: Applied Materials, Aviza Technology, Axic, Hitachi High
Technologies Ningbo Runhua Full Core Hefei Zhenping Technology 9. CMP equipment: Applied Materials,
Ebara Corporation, Entrepix, Kinetic Systems, Novellus
10. Electroplating system equipment: Applied Materials, ECI Technology, Novellus, Semitool, Surfect
11. Graphite components/materials for semiconductor processes: POCO Graphite, Carbone Lorraine, TOYO TANSO
12. Packaging and testing equipment: Hangzhou Changchuan, Peride Technology, Shenzhen Nuotai, Shenzhen Fude , Taicang Chenqi, etc.;
13. Water treatment equipment: Shenzhen Pure Water No. 1, Shenzhen Water Vision, Changzhou Veolia, etc.
Mainland China: Northern Huachuang Microelectronics Equipment, China Microelectronics Equipment, Shanghai
Microelectronics Equipment, Tuojing Technology, China Electronics Equipment Group, China Microelectronics,
Seven Star Huachuang, Huahai Qingke, Shennan Circuits, Ruili Science Instruments, Shanghai Microelectronics,
Dayiheng Precision Machinery, Hanmin Technology, Qisheng Machinery Equipment, Shanghai Kangkesi Trading, etc.
4. Wafer foundries
1. International: GlobalFoundries, Samsung (China) Semiconductor Co., Ltd., Tower Jazz, Dongbu, Magna, IBM,
Fujitsu, Intel, SK Hynix Semiconductor (China) Co., Ltd. 2.
China Mainland China and Taiwan: TSMC, UMC, Hejian Technology, Powerchip, SMIC, Huahong Hongli, Demao,
Wuhan Xinxin, Huawei Microelectronics, Huali Microelectronics, Powerchip, Intel Semiconductor (Dalian) Co., Ltd. ,
Xi”an Microelectronics, Jilin Hua Microelectronics
5. Packaging and testing companies
1. International: Amkor, STATS ChipPAC, J-devices, Unisem, Nepes
2. Mainland China and Taiwan: ASE, Licheng, Nanmao, Qi Bang, KYEC Electronics, Fumao, Lingsheng Precision,
Silicon Products, Changdian, Ute, Advanced Semiconductor, Tongfu Microelectronics, Tianshui Huatian,
Nantong Huada Microelectronics, Verizon United Semiconductor, Intel Products (Chengdu) Co., Ltd., Haitai
Semiconductor (Wuxi) Co., Ltd., Jiangsu Xinchao Technology, Amkor Packaging and Testing (Shanghai) Co., Ltd.,
Sandis Semiconductor (Shanghai) Co., Ltd., Lichengliu, IDM 1, International: Intel, Samsung,
Phase
One Carl, Hynix, NEC, NXP, Renesas, STMicroelectronics, TI, Toshiba
2. Mainland: Shanghai Belling, China Resources Microelectronics, Silan Microelectronics
7. Electronic component distributors
1. International: Avnet, Arrow, Future Electronics, WPG, TTI, Macnica, Digi-Key Corporation, Newark Element14,
Mouser Electronics, Fusion Worldwide
2. China: Comtech, China Electronics, Lubicom, Tycoyuan, Weishixin, Patai, Xinheda, Xinzhi, Beijing Gaozhi,
Asiacom8, electronic manufacturing service providers (EMS) 1.
International
: Flextronics, Jabil, Celestica, New Meiya, Baidian, Plexus, Venture Manufacturing, Cooltech, Hicks, Zhuoneng 2, China: Hon Hai,
New Jinbao, Great Wall Development, USI, Huatai, Asustek, Quanta, Inventec, TPV, Wistron
9. Terminal brands
1. International: Apple, Samsung, IBM, Sony, Toshiba, Dell, Fujitsu, NEC, Panasonic, HP
2. China: Huawei, ZTE, lenovo , Xiaomi, OPPO, ASUS, Acer, Shenzhou, Meizu, Coolpad
10, EDA design software manufacturers
1. International: Synopsys, Mentor, Cadence
2. China: Huada Jiutian, Xinhe Technology, Guangli Micro, Boda Micro, Chip Vision, Xcelis, Shengjing Micro, Jiyesi, Xunmei, etc.
GE VME7807RC-350-00780-411000
GE Single Board Computer VMIVME-7807-411001
VMIVME-9304 GE
VMIVME-332-003230-000E GE
VMIVME-3230 GE
VMIVME-5521 GE
VMIVME-7587 GE
VMIVME-2128 GE
VMIVME-1182 GE
VMIVME-2528 GE
VMIVME-7671-421000 GE
VMIVME-5599 GE
VMIVME-2540 GE
VMIVME-1128 GE
VMIVME-7750-744000 GE
VMIVME-7614-132/350-017614-132D GE
VMIVME-2536 GE
VMIVME-2540-000001 GE
VMIVME-2540 GE
VMIVME-7486 GE
VMIVME-7697350350-017697-350 J GE
VMIVME-7671 GE
VMIVME-4116 GE
VMIVME3113A GE
IC698CMX016 VMIVME-5567-000 350-005567-000
VMIVME-5567-000 GE
IC698CMX016 GE
VMIVME Model 2533 Assy No 332-002533-010E
VMIVME-2128 GE
VMIVME-2510B GE
VMIVME-2536 GE
VMIVME-4140 GE
VMIVME-7452 GE
VMIVME-7455 GE
VMIVME-7459 GE
VMIVME-7486 GE
VMIVME-7658-330/350-007658-330 E GE
VMIVME-7658-330 GE
VMIVME-7658 GE
VMIVME-7698 VMIVME-7698-140 350-017698-140 A
VMIVME-7698-140 GE
VMIVME-7698 GE
VMIVME-7700 350-007700-111000 H GE
VMIVME-7700 GE
VMIVME-7750 VMIVME-7750-760000 350-027750-760000 N
VMIVME-7750-760000 GE
VMIVME-7750 GE
GE Single Board Computer VMIVME-7807
GE microprocessor motherboard VMIVME-7807RC
DS215SDCCG3AZZ01B GE
DS215KLDBG1AZZ03A GE
DS215DMCBG1AZZ03B GE
DS215SLCCG2AZZ01B GE
DS200KLDAG1ACC GE
DS215KLDAG1AZZ02A GE
DS215KLDBG1AZZ03B GE
DS215GHDQG5AZZ01 GE
DS215TCEAG1BZ01A GE
DS215SLCCGZAZZ01B GE
DS215DMCCBG1AZZ03B GE
DS215DMCBG1AZZ03A GE
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