Description
2GUS031803A9 Электрический фильтр ABB
CC – Link и другие. Каждый слот IO может быть выбран автономно в соответствии с потребностями клиента, а один модуль поддерживает до 16 каналов.
Технологии основаны на инновациях2GUS031803A9 Предоставление клиентам высококачественных и надежных продуктов всегда было постоянным стремлением к нулю.
Давайте посмотрим на его инновации и различия с предшественниками: с жидкокристаллическим дисплеем, вы можете увидеть параметры связи, состояние канала IO,
информацию о версии модуля и так далее; 2GUS031803A9 Отладка и обслуживание более интуитивно понятны; ABS огнестойкая пластиковая оболочка, небольшой размер,
легкий вес, с использованием совершенно новой пряжки монтажной карты, установка более прочная и надежная.
(3)Market size:
(4) Related companies: APC, Emerson Network Power, Kehua Hengsheng
(5) Recommendation index: Recommended
4. Switching power supply
5. Power factor correction technology
6. Application of power electronics technology in power systems
7. LED driver power supply
8. Other applications
[Introduction] 1. IC design companies 1. International: Qualcomm, Broadcom, MediaTek, Nvidia, Marvell, Xilinx, Altera2, Taiwan: mainly MediaTek, Duntai Technology, Elan
Electronics, Egis Technology, Sungyang, VIA et al. 3. Mainland China: Unisoc, ZTE Microelectronics, Duntai, HiSilicon Semiconductor, Quanzhi Technology, Huada
Semiconductor, Datang Semiconductor, Zhixin Microelectronics, National Microelectronics, Vimicro Microelectronics, Unisoc Guoxin, National Technology , Orbit, Zhongying
Electronics, Montage Technology, BeidouStar, Beijing Junzheng, GigaDevice, Geke Microelectronics, China Electronics, Weill Semiconductor, Tongchuang National Chip, Fudan
Microelectronics, Apex Microelectronics, Hui Top Technology, MediaTek, Chipone North, Tongfang Microelectronics, Zhongtian Lianke, Shengbang Microelectronics, etc. 2
. Semiconductor materials companies 1. International: JSRMcroelectronics, ETSC Technologies Co. , SEMI…
1. IC design companies
1. International: Qualcomm, Broadcom, MediaTek, Nvidia, Marvell, Xilinx, Altera
2. Taiwan: Mainly MediaTek, Duntai Technology, Elan Electronics, Egis Technology, Sungyang, VIA, etc. .
3. Mainland China: Unisoc, ZTE Microelectronics, Duntai, HiSilicon Semiconductor , Quanzhi Technology, Huada Semiconductor, Datang Semiconductor, Zhixin
Microelectronics, National Microelectronics, Vimicro Microelectronics, Unisoc Guoxin, National Technology , Orbit, Zhongying Electronics, Montage Technology,
BeidouStar, Beijing Junzheng, GigaDevice, Geke Microelectronics, China Electronics, Weill Semiconductor, Tongchuang National Chip, Fudan Microelectronics,
Apex Microelectronics, Hui Top Technology, MediaTek, Chipone North, Tongfang Microelectronics, Zhongtian Lianke, Shengbang Microelectronics, etc.
2. Semiconductor materials companies
1. International: JSR Microelectronics, ETSC Technologies Co. , SEMI, Air Products, Ablestik, Cadence, Abrasive Technology, Praxair Electronics, TBW Industries,
Applied Materials
2. Mainland China: Tepuco Industrial, Zhejiang Jinruihong, Nanjing Guosheng, Hebei Puxing, Youyan, Shandong University of Science and Technology Dingxin,
Beijing Da Bo, Ningbo Jiangfeng, Youyan Yijin, Shanghai Xinyang, Anji, Zhongneng Silicon Technology, Zhonghuan Semiconductor, Jinglong Group, Xinte Energy,
Xi”an LONGi, China Silicon Hi-Tech, Sunshine Energy, Oridian Optoelectronics, Tianhong Silicon, Shanghai Shenhe Thermal Magnetic (wholly owned by a Japanese
company), Guosheng
Electronics, Jiangfeng Electronic Materials, Youyan Yijin, Beijing Dabo, Shanghai Xinyang, Anji Microelectronics, Youyan New Materials, Hubei Xingfu Electronics,
Jianghua Micro, Jin Ruihong, etc.
3. Semiconductor equipment manufacturing companies
1. Wafer cleaning equipment: Applied Materials, Dainippon Screen (DNS) Changzhou Silicon Micro, Kunshan Zhicheng, Beijing Hualin Jiaye, Suzhou Shimike,
Ningbo Runhua Quanxin, Tianjin Nanxuan, Shandong Jie Sheng et al.
2. Heat treatment equipment: Applied Materials, ASM
3. Ion implantation equipment: Applied Materials
4. CVD/PECVD/ALD equipment:
5. PVD equipment: Applied Materials, Aviza Technology, KDF, Novellus, Oerlikon, Northern Microelectronics
6. Photolithography Equipment: ASML, Canon, EV Group, Molecular Imprints, Nikon Precision, Beijing Jingzhen
7. Coating/Developing Equipment: DNS, EV Group, Suss Mi
GE VME7807RC-350-00780-411000
GE Single Board Computer VMIVME-7807-411001
VMIVME-9304 GE
VMIVME-332-003230-000E GE
VMIVME-3230 GE
VMIVME-5521 GE
VMIVME-7587 GE
VMIVME-2128 GE
VMIVME-1182 GE
VMIVME-2528 GE
VMIVME-7671-421000 GE
VMIVME-5599 GE
VMIVME-2540 GE
VMIVME-1128 GE
VMIVME-7750-744000 GE
VMIVME-7614-132/350-017614-132D GE
VMIVME-2536 GE
VMIVME-2540-000001 GE
VMIVME-2540 GE
VMIVME-7486 GE
VMIVME-7697350350-017697-350 J GE
VMIVME-7671 GE
VMIVME-4116 GE
VMIVME3113A GE
IC698CMX016 VMIVME-5567-000 350-005567-000
VMIVME-5567-000 GE
IC698CMX016 GE
VMIVME Model 2533 Assy No 332-002533-010E
VMIVME-2128 GE
VMIVME-2510B GE
VMIVME-2536 GE
VMIVME-4140 GE
VMIVME-7452 GE
VMIVME-7455 GE
VMIVME-7459 GE
VMIVME-7486 GE
VMIVME-7658-330/350-007658-330 E GE
VMIVME-7658-330 GE
VMIVME-7658 GE
VMIVME-7698 VMIVME-7698-140 350-017698-140 A
VMIVME-7698-140 GE
VMIVME-7698 GE
VMIVME-7700 350-007700-111000 H GE
VMIVME-7700 GE
VMIVME-7750 VMIVME-7750-760000 350-027750-760000 N
VMIVME-7750-760000 GE
VMIVME-7750 GE
GE Single Board Computer VMIVME-7807
GE microprocessor motherboard VMIVME-7807RC
DS215SDCCG3AZZ01B GE
DS215KLDBG1AZZ03A GE
DS215DMCBG1AZZ03B GE
DS215SLCCG2AZZ01B GE
DS200KLDAG1ACC GE
DS215KLDAG1AZZ02A GE
DS215KLDBG1AZZ03B GE
DS215GHDQG5AZZ01 GE
DS215TCEAG1BZ01A GE
DS215SLCCGZAZZ01B GE
DS215DMCCBG1AZZ03B GE
DS215DMCBG1AZZ03A GE
Reviews
There are no reviews yet.